Stage 9 of 12Assembly, packaging & test
Packaging
Protecting and connecting the die.
What happens here?
Finished wafers are diced into individual dies, which are mounted in packages that protect them, connect them electrically, and carry away heat — from simple wire-bond packages to advanced 2.5D/3D stacks and chiplets.
How it connects
- Packaging (process)
- Bonder / molding (equipment)
- Substrate & mold compound (materials)
- OSAT (company)
- End application
Who participates
- OSAT providers
- IDMs (in-house)
- Substrate & materials suppliers
Technologies involved
- Wire bonding
- Flip-chip
- Advanced packaging (2.5D/3D, chiplets)
Equipment required
- Dicing saw
- Laser / plasma dicing tools
- Die-attach / pick-and-place
- Die bonder
- Wire bonder
- Flip-chip bonder
- Molding equipment
Materials required
- Dicing tape
- Diamond blades
- Package substrate
- Bond wire / solder bumps
- Underfill
- Mold compound
Skills required
- Mechanical & thermal engineering
- Materials science
- Assembly process engineering
Research happening
- Heterogeneous integration
- 2.5D/3D stacking and HBM
- Panel-level packaging
Companies operating here
- Amkor Technology
- ASE Technology
- CG Power and Industrial Solutions
- HCLTech
- Kaynes Technology
- Micron Technology
- Tata Electronics
From Semitree's directory (a curated sample) — types: OSAT, ATMP, Packaging.
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- Geographic concentration· planned
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