Step 15 of 17Test & assembly (back-end)
Dicing
Cutting the wafer into individual dies.
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At a glance
Inputs
- Tested wafer
- Dicing tape / frame
- Wafer map
ProcessDicing
Outputs
- Singulated individual dies, sorted good/bad
What is it?
Separating the wafer into individual dies (chips) by sawing, laser, or plasma along the scribe lines between dies.
Why is it needed?
Every die must be singulated before it can be packaged. Dicing has to separate cleanly without chipping or cracking the brittle silicon, which would kill otherwise-good dies.
How does it work?
The wafer is mounted on adhesive dicing tape for support. A diamond blade, laser, or plasma process cuts along the scribe streets between dies.
Good dies (per the wafer-test map) are picked from the tape for packaging; bad ones are discarded.
Critical parameters
- Kerf width
- Chipping (front/back)
- Cut alignment
- Die-break strength
Typical defects
- Edge chipping
- Micro-cracks
- Delamination
- Saw-street misalignment
Equipment involved
- Dicing saw
- Laser / plasma dicing tools
- Die-attach / pick-and-place
Materials involved
- Dicing tape
- Diamond blades