PackagingMVP
Chiplet package explorer
See how multiple dies — compute, memory, I/O — can be integrated in one package, and the trade-offs of each approach.
Inputs
Educational explorer — not a package designer
A conceptual view of how chiplets can be integrated. It illustrates arrangements and trade-offs; it does not design or validate a real package.
Separate dies sit next to each other on the package substrate and connect through its wiring.
- Simplest multi-die arrangement; each die is placed and bonded on the substrate.
- Die-to-die links go through the substrate, so they are longer and lower-density than 2.5D/3D.
- Heat spreads across the whole footprint, which is relatively easy to cool.
Interpretation
Chiplets split what might have been one large die into several smaller ones, then reunite them in a package. How they are joined — side by side through the substrate, on a shared interposer, over an embedded bridge, or stacked vertically — trades off die-to-die bandwidth, footprint, cost, and how hard the result is to cool. Switch between the styles above to compare them.
Formula
side-by-side · interposer · bridge · stacked
Conceptual, educational.
Assumptions & validity
This tool assumes:
- Conceptual schematic; relative sizes are illustrative, not to scale.
- Does not model electrical, thermal, or mechanical design of a real package.