Chip Manufacturing · Topic 16 of 16
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Chip ManufacturingLesson 16 of 16
Final test
Testing the finished, packaged part before it ships.
What you’ll learn
- What final test covers
- Burn-in and reliability
- Why re-test after packaging
Why it matters
Final test is the last guarantee that a shipped chip actually works.
Explanation
After packaging, each part is tested again — often across voltage, temperature, and speed — because packaging can introduce new faults. Some parts undergo burn-in to weed out early-life failures.
Passing parts are graded, marked, and shipped.
Visual explanation
Key terminology
- Final/package test
- Testing the packaged device.
- Burn-in
- Stress at elevated voltage/temperature to expose weak parts.
Example
Automotive chips face especially stringent final test and burn-in for reliability.
Common mistakes
Watch out for:
- Assuming wafer test makes final test redundant — packaging adds new failure modes.
Real-world application
Test cost is a meaningful fraction of total chip cost, especially for complex parts.
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Final test
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