High-bandwidth memory (HBM)
Stacked DRAM for bandwidth-hungry accelerators.
HBM stacks multiple DRAM dies connected by through-silicon vias to deliver very high bandwidth, and has become critical for AI accelerators. Research targets taller stacks, thermal limits, and base-die integration.
Technologies
HBMTSVDie stacking
Devices
DRAMMemory stack
Materials
Silicon (TSV)Microbumps
Applications
AI / HPCGPUs
Active research directions
- Stack height & thermal limits
- Bandwidth scaling
- Base-die integration