ManufacturingMVP
Die per wafer
Estimate how many rectangular dies fit on a round wafer (de Vries approximation).
Inputs
Result
Enter values and calculate to see the result.
Interpretation
Enter the wafer diameter and die footprint. Die area is taken as width × height.
Formula
DPW ≈ π·d² / (4·S) − π·d / √(2·S)
d = wafer diameter, S = die area. The second term captures edge loss.
Variables
| Symbol | Variable | Unit |
|---|---|---|
| DPW | Die per wafer | — |
| d | Wafer diameter | m |
| S | Die area (w × h) | m² |
Assumptions & validity
This tool assumes:
- de Vries approximation for die per wafer.
- Rectangular dies; no scribe-line or edge-exclusion width is modeled.
- Result is an estimate — real fabs use exact layout/packing tools.
Worked example
300 mm wafer, 10 mm × 10 mm die (S = 100 mm²).
DPW ≈ π·0.3²/(4·1e-4) − π·0.3/√(2·1e-4) ≈ 640