Chip Manufacturing · Topic 14 of 16
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Chip ManufacturingLesson 14 of 16
Dicing
Cutting the wafer into individual dies.
What you’ll learn
- How wafers are singulated
- Dicing methods
- Why edge quality matters
Why it matters
Dicing turns one wafer into the many individual chips that get packaged.
Explanation
The wafer is mounted on tape and cut along the scribe lines between dies, using a precision saw or laser. Only the dies that passed wafer test proceed.
Clean cuts avoid chipping and cracks that would weaken the die.
Visual explanation
Key terminology
- Singulation
- Separating the wafer into individual dies.
- Scribe line
- The spacing between dies where cuts are made.
Example
Laser dicing can reduce mechanical stress on fragile advanced dies.
Common mistakes
Watch out for:
- Overlooking that dicing damage can crack dies if not controlled.
Real-world application
Thin dies for stacked packages need especially gentle singulation.
Explore related concepts
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Dicing
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Chip Packaging
Chip Manufacturing
What happens after the wafer is made — turning a fragile silicon die into a usable, connected, cooled component.
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