PackagingMVP
Bump / interconnect pitch
Connection count, array span, and areal density from a bump array's rows, columns, and pitch.
Inputs
Result
Enter values and calculate to see the result.
Interpretation
Enter the number of rows and columns and the bump pitch.
Formula
count = rows × columns ; density = 1 / pitch²
Density depends only on pitch.
Variables
| Symbol | Variable | Unit |
|---|---|---|
| count | Total connections | dimensionless |
| rows, columns | Array dimensions | whole numbers |
| pitch | Bump pitch | m |
| density | Connections per area | 1/m² (shown per mm²) |
Assumptions & validity
This tool assumes:
- Full rectangular grid of connections.
- Geometric maximum; real designs reserve many bumps for power/ground and keep-outs.
Worked example
20 × 20 array, 130 µm pitch.
count = 400; density = 1/(130 µm)² ≈ 59 per mm²