Stage 5 of 12Design
Chip design
Architecture to tapeout.
What happens here?
Fabless companies and IDM design teams turn a specification into a verified layout — architecture, RTL, logic, physical design, and signoff — ready to hand to a fab.
Who participates
- Fabless companies
- IDMs (design)
- Design-service firms
Technologies involved
- RTL / HDL design
- Analog & mixed-signal design
- Computer architecture
- Physical design
Equipment required
- EDA software & compute
Skills required
- Digital & analog design
- HDL (Verilog/VHDL)
- Verification
- DSP
Research happening
- Chiplet & 3D architectures
- Domain-specific accelerators
- Low-power design
Companies operating here
- AMD
- Arm
- Broadcom
- Cadence
- HCLTech
- Infineon Technologies
- Intel
- Micron Technology
- NVIDIA
- Qualcomm
- Samsung Electronics
- SK hynix
- Synopsys
- Texas Instruments
From Semitree's directory (a curated sample) — types: Fabless, Design services, IDM.
Explore the detail
Manufacturing processes
Supply-chain intelligence
These dimensions are architected for this stage. Only data derived from verified sources is shown — no speculative figures.
- Companies· available
- Geographic concentration· planned
- Supply-chain risk· planned
- Capacity· planned
- Investments· planned
- Technology dependencies· planned