Packaging · Topic 10 of 14
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PackagingLesson 10 of 14
2.5D integration
Placing multiple dies side-by-side on a shared interposer.
What you’ll learn
- What an interposer is
- Why 2.5D exists
- Typical use with HBM
Why it matters
2.5D links dies with dense, short wiring that a normal package can't provide.
Explanation
In 2.5D, several dies sit next to each other on a silicon (or organic) interposer that carries fine, dense wiring between them, often with through-silicon vias down to the package.
It gives near-on-die bandwidth between separate dies — commonly used to place high-bandwidth memory beside a processor.
Visual explanation
Key terminology
- Interposer
- A wiring layer between dies and the package substrate.
- TSV
- Through-silicon via — a vertical connection through silicon.
Example
A GPU and stacks of HBM share a silicon interposer for very high memory bandwidth.
Common mistakes
Watch out for:
- Confusing 2.5D (side-by-side on an interposer) with true 3D stacking.
Real-world application
2.5D + HBM is the standard recipe for AI accelerators and high-end GPUs.
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2.5D integration
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3D IC
Packaging
Stacking dies vertically and connecting them through silicon.
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