Problem #005Potential opportunityEmerging Technologies
Advanced packaging & chiplet capability
As gains from shrinking transistors slow, advanced packaging and chiplets carry more of the performance improvement. Building this capability — not just traditional packaging — is where much of the future value sits.
Industry: Advanced packaging
Why it matters
Advanced packaging is becoming a strategic capability in its own right, and it is a realistic place for newer ecosystems to move up the value chain from basic assembly.
Evidence
- ReportedThe shift of performance gains toward advanced packaging and chiplets is extensively documented in the public record.
- ResearchingWhere India and other newer ecosystems can compete in advanced packaging specifically is still being mapped.
Affected participants
- OSAT/ATMP firms
- Fabless & IDM designers
- Substrate & materials suppliers
Who experiences it
- Packaging firms moving up-market
- System designers adopting chiplets
Current alternatives
- Traditional single-die packaging
- Outsourcing advanced packaging to established hubs
Known limitations
- Requires substrates, materials, and process depth
- Capital and know-how barriers
Potential approaches
- Focused advanced-packaging lines
- Substrate & materials localisation to support it
Connected to the ecosystem
Related companies
Related technologies
Supply-chain stage
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